Springer - Research On Chemical Mechanical Polishing Mechanism Of Novel Diffusion... (2018 EN)

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    Author: Jie Cheng
    Full Title: Research On Chemical Mechanical Polishing Mechanism Of Novel Diffusion Barrier Ru For Cu Interconnect
    Publisher: Springer; 1st ed. 2018 edition (September 8, 2017)
    Year: 2018
    ISBN-13: 9789811061653 (978-981-10-6165-3), 9789811061646 (978-981-10-6164-6)
    ISBN-10: 9811061653, 9811061645
    Pages: 137
    Language: English
    Genre: Engineering
    File type: PDF (True)
    Quality: 10/10
    Price: 85.59 €

    This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

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