Author: Jie Cheng Full Title: Research On Chemical Mechanical Polishing Mechanism Of Novel Diffusion Barrier Ru For Cu Interconnect Publisher: Springer; 1st ed. 2018 edition (September 8, 2017) Year: 2018 ISBN-13: 9789811061653 (978-981-10-6165-3), 9789811061646 (978-981-10-6164-6) ISBN-10: 9811061653, 9811061645 Pages: 137 Language: English Genre: Engineering File type: PDF (True) Quality: 10/10 Price: 85.59 € This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research. ------------- Our members see more. Join us!